Description

Designed to lower CPU temperatures effectively, TG-30 is a premium thermal compound which contains diamond powder to improve thermal conductivity to maximize heat transfer, providing a longer lifespan eliminating dry-out or cracking while in use. This thermal compound application kit includes a set of easily-applied tools for immediate use. On top of that, the TG-30 s honeycomb stencil can help users to apply thermal compound for a neat and well-covered surface which fits all CPUs

TG 30 Thermal Compound 4g

Product form
  • Get 5% on OFF Electronics, use code TECHIE5 at checkout!

$76.97

Delivered Within 10 To 12 Days.

    Description

    Designed to lower CPU temperatures effectively, TG-30 is a premium thermal compound which contains diamond powder to improve thermal conductivity to maximize heat transfer, providing a longer lifespan eliminating dry-out or cracking while in use. This thermal compound application kit includes a set of easily-applied tools for immediate use. On top of that, the TG-30 s honeycomb stencil can help users to apply thermal compound for a neat and well-covered surface which fits all CPUs

    Customer Reviews

    Be the first to write a review
    0%
    (0)
    0%
    (0)
    0%
    (0)
    0%
    (0)
    0%
    (0)

    Recently viewed products

    Login

    Forgot your password?

    Don't have an account yet?
    Create account